IECQ-C BSI 15.00011 “E-Labelling that may be affixed to or laser marked into the surface of electric devices and components.”
The Chinese Government is undertaking a consolidation of the Fabless Semiconductor Market. They have backed Tsinghua Holding to expand into the IC market by committing $100 billion over 5-years. Currently there are only 4 companies global in production at 14nm. They are Intel, TSMC, Global and Samsung. SMIC is not far behind.
A summary of recent activity is shown below
Signed a product development agreement with Intel for x86 Atom Processors
Acquired RDA Microelectronics for $907 million.
Intel acquired a 20% stake in Tsinghua for $1.5 Billion, which also owns Spreadtrum and RDA Microelectronics
Xiamen Government & Fujian Electronics
Formed partnership with UMC to build a $2.6 billion 300nm fab in Xiamen, China
As part of Qualcomm’s settlement with China’s NDRC, the company agreed to expand its partnership with SMIC
Hua Capital Management & other Chinese investors
US based CMOS image sensor specialist Omnivision agreed to be purchased for $1.9 billion
U.S. based DRAM and SRAM specialist ISSI agreed to be purchased for $731 million
NXP announced that it was selling its RF power business to the investment group for $1.8 billion
SMIC & Huawei
Announced that SMIC, Huawei, Qualcomm and IMEC would form a joint R & D company for 14nm technology
Hefei Construction Investment and Holding
Formed a joint venture with Powerchip to construct a $2.2 billion LCD driver Fab in Hefei, China
Offered to purchase Singapore based OSAT STATS ChipPAC for $780 million
Made a $23 billion offer to purchase U.S. based memory giant Micron
Beijing IC Industrial Development Fund & Other Chinese Investors
In 2014 Chinese Investors contributed $465 million to SMIC’s 300mm diameter wafer and a further $350 million in 2015
TSMC & Potentially Chinese Investors
TSMC is expected to announce $3 Billion construction of a 300mm Fab in China for 20/28 nm product and may partner with Chinese Investors
We believe this consolidation is going to put some real pressure on the Taiwan IC market especially with the likes of TSMC and UMC who are both global leaders. It is industry standard practice today to mark all IC’s with laser rather than ink. The e-Label could be applied concurrent with the standard identity/logo. Each component would then have an unambiguously unique identifier and be tracked back to the parent wafer. It is our hope to present these ideas to some CB's and perhaps TSIA (Taiwanese Semiconductor Industry Association) as well as the Chinese Standards Governing Body CEPREI after the Chinese New Year.